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Tekbond®

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Tekbond® Benefits

TEKBOND® TPEs……

A unique class of engineering material for over-molding, without prior surface treatment, directly onto a wide range of substrates including many neat and glass-filled engineered part substrates. It ensures strong bonds to polycarbonate (PC), ABS, SAN, HIPS, PC/ABS alloys, acrylic, cellulose propionate, rigid PVC, Nylon 6,6 and PCT polyester. This enables production of hybrid parts with unique performance and marketing appeal, often at substantially reduced finished cost.

Tekbond® is available in a wide hardness range and virtually any color. This comprehensive compound can eliminate the need to inventory multiple over-molding compounds for multi-component applications. Pigment master-batches can be easily added to achieve desired colors. Among the many pleasing visual appearances one can achieve are shiny, dull, texture, leather, frosty, pearlescent, sparkling or glowing. Pad printing of Tekbond® materials can be accomplished with special inks.

Durability is the key because many consumer products take considerable abuse from impact. Tekbond® improves product longevity by incorporating over-molded elastomers into outer housings. Similarly, Tekbond® can be molded into feature areas to provide anti-skid and stabilizing performance. Internally, the over-mold can be placed in areas to provide shock-absorbing mounts, at mating surfaces, to form integral dust and moisture seals, and at pivot points to form flexible joints.

Tekbond® TPEs blend additives and copolymers into special formulations that form extremely durable bonds to engineering resin substrates.

These performance highlights promote design freedom. You can produce a product that is solid but provides a cushioning grip, and one that is durably wear-resistant but offers a soft touch with an insulating layer to reduce vibration. There is no requirement for adhesives, bonding agents, physical or mechanical attachments or surface pre-treatment.


 
Monprene tpe – thermoplastic elastomer – benefits - Strong bonding to neat and glass-filled engineering substrates such as PC, ABS, PC/ABS, acrylics, cellulose propionate, nylon 66 and PCT polyester.


Tekbond®

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